Surface mounting process:

Includes five points: 1> Component installation type; 2> Process flow; 3> Welding process; 4>CB production process; 5> Cleaning process of the mounting plate.

Surface mount type:

1> Surface mounted components only;

2> Surface mounted components and traditional plug-in components mixed board (3 kinds);

(1) A side insertion and surface installation mix; B surface mounting.

② A side only insert components; B side insertion and surface mounting.

③ Both sides of A and B are mixed with insert and surface mounting.

3> A side only insert, B side insert and surface mounting

Note: Generally, there are the first and third kinds

Surface mounting equipment (mounter) :

Speed mode to center mode

1> Low speed (slow) more than 1 second/point 1> mechanical alignment chip±0.1mm

2> middle speed 0.2-1 seconds/point 2> Laser alignment chip±0.1mm

3> High-speed (fast) less than 0.2 seconds/point 3> Visual alignment chip±0.1mm

Mechanical alignment is contact alignment, visual alignment is non-contact alignment function: two:

1> Single function (high-speed machine); Only the patch components between (0402-1206) can be mounted.

2> One more function (medium speed machine); Common models are (CP33C) any kind of patch can be affixed.

SMT environment requirements:

① Temperature: 25±3℃; The room temperature is in the range of 10℃ ~ 30℃;

② Humidity: 65±10%; Places with non-condensing humidity in the range of 20% to 90%;

3 Dust-free and smoke-free places; No severe vibration site;

④ Good grounding; No flammable and corrosive gases around; Power supply voltage fluctuation must be within ±5%;

⑤ have a place strong enough to support the mass of the machine;